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Datasheet 69

4 Mechanical Specifications

This chapter provides the mechanical specifications of the Itanium 2 processor.

4.1 Mechanical Dimensions

The Itanium 2 processor package is comprised of an interposer, a processor package substrate, and

an integrated heat spreader (IHS), as illustrated in Figure 4-1. The interposer interfaces with the

socket and the power pod and contains 611 pins which are positioned in a 25 x 28 grid. The IHS,

which is mounted on the top surface of the processor package substrate, efficiently transfers the

heat generated by the die to its surface.

Figure 4-2 contains mechanical drawings and dimensions for the Itanium 2 processor package.

Figure 4-3 contains mechanical drawing for the power tab. All dimensions are measured in mm

and are not to scale.

Figure 4-1. Itanium

2 Processor Package

001160e

IHS

Interposer

Processor

Package

Substrate

(OLGA)

1 2 ... 64 65 66 67 68 69 70 71 72 73 74 ... 107 108

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Intel Itanium 2 Processor Manuale Utente Pagina 69