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Datasheet 41

Land Listing and Signal Descriptions

4 Land Listing and Signal

Descriptions

This chapter provides the processor land assignment and signal descriptions.

4.1 Processor Land Assignments

This section contains the land listings for the processor. The land-out footprint is shown

in Figure 13 and Figure 14. These figures represent the land-out arranged by land

number and they show the physical location of each signal on the package land array

(top view). Table 23 provides a list of processor lands ordered alphabetically by land

(signal) name. Table 24 provides a list of processor lands ordered by land number.

1 2 ... 36 37 38 39 40 41 42 43 44 45 46 ... 101 102

Celeron 1
Dual-Core Processor 1
2 Datasheet 2
Contents 3
4 Datasheet 4
Datasheet 5 5
6 Datasheet 6
Series 7
Revision History 8
1 Introduction 9
1.1.1 Processor Terminology 10
1.2 References 11
12 Datasheet 12
Introduction 12
2 Electrical Specifications 13
2.3 Voltage Identification 14
Datasheet 15 15
Electrical Specifications 15
16 Datasheet 16
Datasheet 17 17
18 Datasheet 18
Table 6. V 20
Overshoot 21
2.7 Signaling Specifications 22
2.7.1 FSB Signal Groups 23
24 Datasheet 24
1. Signals that do not have R 24
Datasheet 27 27
2.8 Clock Specifications 28
30 Datasheet 30
VHavg (mV) 31
250 + 0.5 (VHavg - 700) 31
550 + 0.5 (VHavg - 700) 31
2.9 PECI DC Specifications 32
3 Package Mechanical 33
Specifications 33
34 Datasheet 34
Datasheet 35 35
36 Datasheet 36
3.7 Processor Materials 38
3.8 Processor Markings 38
Preliminary 39
Socket 775 39
Quadrants 39
Top View 39
40 Datasheet 40
4 Land Listing and Signal 41
Descriptions 41
42 Datasheet 42
Datasheet 43 43
Table 23. Alphabetical Land 44
Assignments 44
Table 24. Numerical Land 54
Assignment 54
64 Datasheet 64
Datasheet 65 65
66 Datasheet 66
Datasheet 67 67
68 Datasheet 68
Datasheet 69 69
70 Datasheet 70
Datasheet 71 71
72 Datasheet 72
5 Thermal Specifications and 73
Design Considerations 73
Table 27. Thermal Profile 75
Figure 15. Thermal Profile 75
5.1.2 Thermal Metrology 76
5.2.1 Thermal Monitor 76
5.2.2 Thermal Monitor 2 77
5.2.3 On-Demand Mode 78
5.2.4 PROCHOT# Signal 79
5.2.5 THERMTRIP# Signal 79
5.3 Thermal Diode 80
Datasheet 81 81
PECI Host 82
Controller 82
Domain 0 82
Datasheet 83 83
5.4.2.1 PECI Device Address 84
5.4.2.2 PECI Command Support 84
6 Features 85
6.2.1 Normal State 86
6.2.2.1 HALT Powerdown State 87
6.2.3.1 Stop-Grant State 88
6.3 Enhanced Intel SpeedStep 89
Technology 89
Features 90
90 Datasheet 90
Datasheet 91 91
7.1 Mechanical Specifications 92
Boxed Proc OverallView 93
7.2 Electrical Requirements 94
Datasheet 95 95
7.3 Thermal Specifications 96
Datasheet 97 97
98 Datasheet 98
Datasheet 99 99
100 Datasheet 100
8 Debug Tools Specifications 101
Debug Tools Specifications 102
102 Datasheet 102

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Intel BX80557E1400 Scheda Tecnica Pagina 41

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