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NB Reference Thermal Solution #2

32 Intel

E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

7.3 Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation

requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB

thermal solution are shown in Figure 7-2.

When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 7-2,

any motherboard components placed between the heatsink and motherboard cannot exceed

4.14 mm (0.16 in.) in height.

Figure 7-1. Second NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity

0.5

0.8

1.1

1.4

1.7

2.3

0 100 200 300 400 500 600

Flow Rate (LFM)

Ȍca (°C/W)

1 2 ... 27 28 29 30 31 32 33 34 35 36 37 ... 53 54

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Intel E8500 Manuale Utente Pagina 32