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Thermal Specifications

16 Intel

E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NOTE:

1. These specifications are based on silicon characterization, however, they may be updated as further data

becomes available.

Table 3-2. Intel

E8501 Chipset NB Thermal Specifications

Parameter Value Notes

case_max

104°C

case_min

5°C

TDP

with 1 XMB attached

26.0 W

TDP

with 2 XMBs attached

28.2 W

TDP

with 3 XMBs attached

30.4 W

TDP

with 4 XMBs attached

32.6 W

Table 3-3. Intel

E8500 Chipset XMB Thermal Specifications

Parameter Value Notes

case_max

105°C

case_min

5°C

TDP

dual channel

11.1 W DDR2-400

Table 3-4. Intel

E8501 Chipset XMB Thermal Specifications

Parameter Value Notes

case_max

105°C

case_min

5°C

TDP

dual channel

12.1W DDR2-400

1 2 ... 11 12 13 14 15 16 17 18 19 20 21 ... 53 54

E8500/E8501 Chipset North 1
Bridge (XMB) 1
Contents 3
Revision History 6
1 Introduction 7
1.2 Definition of Terms 8
1.3 Reference Documents 9
Introduction 10
2 Packaging Technology 11
Packaging Technology 12
14 Intel 14
3 Thermal Specifications 15
16 Intel 16
4 Thermal Simulation 17
Thermal Simulation 18
5 Thermal Metrology 19
Thermal Metrology 20
5.2 Power Simulation Software 21
6.1 Operating Environment 23
6.2 Heatsink Performance 23
24 Intel 24
Heatsink 25
Motherboard 25
TNB Location 26
4X Ø 2.95 ± 0.0254mm 26
4X Ø 5.5mm 26
6.5.1 Heatsink Orientation 27
28 Intel 28
6.6 Reliability Guidelines 29
30 Intel 30
7.1 Operating Environment 31
7.2 Heatsink Performance 31
32 Intel 32
7.5.1 Heatsink Orientation 34
7.6 Reliability Guidelines 35
36 Intel 36
8.1 Operating Environment 37
8.2 Heatsink Performance 37
Heatsink Fin 38
Heatsink Base 38
XMB Location 39
40 Intel 40
8.6 Reliability Guidelines 41
42 Intel 42
A Thermal Solution Component 43
Suppliers 43
44 Intel 44
Part Intel Part Number 45
Supplier 45
(Part Number) 45
Contact Information 45
46 Intel 46
B Mechanical Drawings 47
Mechanical Drawings 48

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