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Document # 320834-001Intel® Core™ i7 Processor Extreme Edition and Intel® Core™ i7 ProcessorDatasheet, Volume 1November 2008

Introduction10 Datasheet The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and Streaming

Boxed Processor Specifications100 Datasheet Figure 8-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view)Figure 8-8. Boxed Proces

Datasheet 101Boxed Processor Specifications8.4.2 Variable Speed FanIf the boxed processor fan heatsink 4-pin connector is connected to a 3-pin mother

Boxed Processor Specifications102 Datasheet If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the mot

Datasheet 11Introduction• Intel® 64 Architecture — An enhancement to Intel's IA-32 architecture, allowing the processor to execute operating sys

Introduction12 Datasheet

Datasheet 13Electrical Specifications2 Electrical Specifications2.1 Intel® QPI Differential SignalingThe processor provides an Intel QPI port for hig

Electrical Specifications14 Datasheet ensure that the voltage provided to the processor remains within the specifications listed in Table 2-7. Failure

Datasheet 15Electrical SpecificationsThe processor uses eight voltage identification signals, VID[7:0], to support automatic selection of voltages. T

Electrical Specifications16 Datasheet 0 0 0 1 1 1 1 1 1.41875 0 1 1 1 1 0 1 0 0.850000 0 1 0 0 0 0 0 1.41250 0 1 1 1 1 0 1 1 0.843740 0 1 0 0 0 0 1 1.

Datasheet 17Electrical Specifications2.6 Reserved or Unused SignalsAll Reserved (RSVD) signals must remain unconnected. Connection of these signals t

Electrical Specifications18 Datasheet 2.7 Signal GroupsSignals are grouped by buffer type and similar characteristics as listed in Table 2-3. The buff

Datasheet 19Electrical SpecificationsNote:1. Unless otherwise specified, signals have ODT in the package with 50 Ω pulldown to VSS.2. PREQ#, BPM[7:0]

2 Datasheet INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO A

Electrical Specifications20 Datasheet 2.9 Platform Environmental Control Interface (PECI) DC SpecificationsPECI is an Intel proprietary interface that

Datasheet 21Electrical Specifications2.9.2 Input Device HysteresisThe input buffers in both client and host models must use a Schmitt-triggered input

Electrical Specifications22 Datasheet .Notes:1. For functional operation, all processor electrical, signal quality, mechanical and thermal specificati

Datasheet 23Electrical Specifications2.11.1 DC Voltage and Current SpecificationTable 2-7. Voltage and Current Specifications Symbol Parameter Min Ty

Electrical Specifications24 Datasheet 1. The VCC_MIN and VCC_MAX loadlines represent static and transient limits. See Section 2.11.2 for VCC overshoot

Datasheet 25Electrical SpecificationsNotes:1. This is a typical voltage, see Table 2-10 for VTT_Max and VTT_Min voltage.Figure 2-3. VCC Static and Tr

Electrical Specifications26 Datasheet Table 2-10. VTT Static and Transient ToleranceITT (A) VTT_Max (V) VTT_Typ (V) VTT_Min (V) Notes11. The ITT liste

Datasheet 27Electrical SpecificationsNotes:1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.2. VIL is d

Electrical Specifications28 Datasheet 4. VIH and VOH may experience excursions above VDDQ. However, input signal drivers must comply with the signal q

Datasheet 29Electrical SpecificationsNotes:1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.2. The VTTA

Datasheet 3Contents1Introduction...91.1 Ter

Electrical Specifications30 Datasheet 2.11.3 Die Voltage ValidationCore voltage (VCC) overshoot events at the processor must meet the specifications i

Datasheet 31Package Mechanical Specifications3 Package Mechanical SpecificationsThe processor is packaged in a Flip-Chip Land Grid Array package that

Package Mechanical Specifications32 Datasheet Figure 3-2. Processor Package Drawing (Sheet 1 of 2)

Datasheet 33Package Mechanical SpecificationsFigure 3-3. Processor Package Drawing (Sheet 2 of 2)

Package Mechanical Specifications34 Datasheet 3.2 Processor Component Keep-Out ZonesThe processor may contain components on the substrate that define

Datasheet 35Package Mechanical Specifications3.6 Processor Mass SpecificationThe typical mass of the processor is 35g. This mass [weight] includes al

Package Mechanical Specifications36 Datasheet 3.9 Processor Land CoordinatesFigure 3-5 shows the top view of the processor land coordinates. The coord

Land ListingDatasheet 374 Land ListingThis section provides sorted land list in Table 4-1 and Table 4-2. Table 4-1 is a listing of all processor land

Land Listing38 Datasheet DDR0_DQ[3] R42 CMOS I/ODDR0_DQ[30] C38 CMOS I/ODDR0_DQ[31] B38 CMOS I/ODDR0_DQ[32] B5 CMOS I/ODDR0_DQ[33] C4 CMOS I/ODDR0_DQ[

Land ListingDatasheet 39DDR0_RESET# D32 CMOS ODDR0_WE# B13 CMOS ODDR1_BA[0] C18 CMOS ODDR1_BA[1] K13 CMOS ODDR1_BA[2] H27 CMOS ODDR1_CAS# E14 CMOS OD

4 Datasheet 7.2 Clock Control and Low Power States...897.2.1 Thread and Core Power S

Land Listing40 Datasheet DDR1_DQ[6] Y40 CMOS I/ODDR1_DQ[60] V9 CMOS I/ODDR1_DQ[61] W5 CMOS I/ODDR1_DQ[62] AA7 CMOS I/ODDR1_DQ[63] W9 CMOS I/ODDR1_DQ[7

Land ListingDatasheet 41DDR2_DQ[19] J39 CMOS I/ODDR2_DQ[2] V36 CMOS I/ODDR2_DQ[20] P40 CMOS I/ODDR2_DQ[21] N36 CMOS I/ODDR2_DQ[22] L40 CMOS I/ODDR2_D

Land Listing42 Datasheet DDR2_MA[3] J20 CMOS ODDR2_MA[4] F20 CMOS ODDR2_MA[5] K23 CMOS ODDR2_MA[6] K22 CMOS ODDR2_MA[7] J24 CMOS ODDR2_MA[8] L25 CMOS

Land ListingDatasheet 43QPI_DTX_DN[2] AK38 QPI OQPI_DTX_DN[3] AJ39 QPI OQPI_DTX_DN[4] AJ40 QPI OQPI_DTX_DN[5] AK41 QPI OQPI_DTX_DN[6] AH42 QPI OQPI_D

Land Listing44 Datasheet RSVD P2RSVD V2RSVD B36RSVD V43RSVD B20RSVD D25RSVD B28RSVD A27RSVD E15RSVD E13RSVD C14RSVD E12RSVD P37RSVD E35RSVD K37RSVD K3

Land ListingDatasheet 45RSVD AE4RSVD AE5RSVD AE6RSVD AF1RSVD AF2RSVD AF3RSVD AF4RSVD AF6RSVD AG1RSVD AG2RSVD AG4RSVD AG5RSVD AG6RSVD AG7RSVD AG8RSVD

Land Listing46 Datasheet RSVD AU6RSVD AU7RSVD AU8RSVD AV1RSVD AV2RSVD AV35RSVD AV42RSVD AV43RSVD AV5RSVD AV7RSVD AV8RSVD AW2RSVD AW3RSVD AW39RSVD AW4R

Land ListingDatasheet 47VCC AK33 PWRVCC AL12 PWRVCC AL13 PWRVCC AL15 PWRVCC AL16 PWRVCC AL18 PWRVCC AL19 PWRVCC AL21 PWRVCC AL24 PWRVCC AL25 PWRVCC A

Land Listing48 Datasheet VCC AT12 PWRVCC AT13 PWRVCC AT15 PWRVCC AT16 PWRVCC AT18 PWRVCC AT19 PWRVCC AT21 PWRVCC AT24 PWRVCC AT25 PWRVCC AT27 PWRVCC A

Land ListingDatasheet 49VCC AY28 PWRVCC AY30 PWRVCC AY31 PWRVCC AY33 PWRVCC AY34 PWRVCC AY9 PWRVCC BA10 PWRVCC BA12 PWRVCC BA13 PWRVCC BA15 PWRVCC BA

Datasheet 5Tables1-1 References ...112-1 Voltage I

Land Listing50 Datasheet VDDQ J28 PWRVDDQ K16 PWRVDDQ K21 PWRVDDQ K26 PWRVDDQ L14 PWRVDDQ L19 PWRVDDQ L24 PWRVDDQ M17 PWRVDDQ M27 PWRVID[0]/MSID[0] AL

Land ListingDatasheet 51VSS AL11 GNDVSS AL14 GNDVSS AL17 GNDVSS AL2 GNDVSS AL20 GNDVSS AL22 GNDVSS AL23 GNDVSS AL26 GNDVSS AL29 GNDVSS AL32 GNDVSS AL

Land Listing52 Datasheet VSS AT23 GNDVSS AT26 GNDVSS AT29 GNDVSS AT32 GNDVSS AT35 GNDVSS AT38 GNDVSS AT41 GNDVSS AT7 GNDVSS AT8 GNDVSS AU1 GNDVSS AU11

Land ListingDatasheet 53VSS D3 GNDVSS D33 GNDVSS D38 GNDVSS D43 GNDVSS D8 GNDVSS E1 GNDVSS E36 GNDVSS E41 GNDVSS E6 GNDVSS F29 GNDVSS F34 GNDVSS F39

Land Listing54 Datasheet VSS U7 GNDVSS V10 GNDVSS V35 GNDVSS V40 GNDVSS V5 GNDVSS W3 GNDVSS W38 GNDVSS W43 GNDVSS W8 GNDVSS Y1 GNDVSS Y11 GNDVSS Y33 G

Land ListingDatasheet 55Table 4-2. Land Listing by Land Number (Sheet 1 of 36)LandNo.Pin NameBufferTypeDirectionA10 DDR0_MA[13] CMOS OA14 VDDQ PWRA15

Land Listing56 Datasheet AC37 CAT_ERR# GTL I/OAC38 QPI_DTX_DN[16] QPI OAC39 QPI_DTX_DP[16] QPI OAC4 RSVDAC40 QPI_DTX_DN[15] QPI OAC41 QPI_DTX_DP[15] Q

Land ListingDatasheet 57AF9 VTTD PWRAG1 RSVDAG10 TMS TAP IAG11 VSS GNDAG2 RSVDAG3 VSS GNDAG33 VSS GNDAG34 VTTA PWRAG35 PROCHOT# GTL I/OAG36 SKTOCC# G

Land Listing58 Datasheet AK2 RSVDAK20 VSS GNDAK21 VCC PWRAK22 VSS GNDAK23 VSS GNDAK24 VCC PWRAK25 VCC PWRAK26 VSS GNDAK27 VCC PWRAK28 VCC PWRAK29 VSS

Land ListingDatasheet 59AM12 VCC PWRAM13 VCC PWRAM14 VSS GNDAM15 VCC PWRAM16 VCC PWRAM17 VSS GNDAM18 VCC PWRAM19 VCC PWRAM2 RSVDAM20 VSS GNDAM21 VCC

6 Datasheet

Land Listing60 Datasheet AN5 RSVDAN6 RSVDAN7 VSS GNDAN8 VID[7] CMOS OAN9 VID[2]/MSID[2] CMOS I/OAP1 VSS GNDAP10 VSS GNDAP11 VSS GNDAP12 VCC PWRAP13 VC

Land ListingDatasheet 61AR37 RSVDAR38 QPI_DRX_DN[19] QPI IAR39 VSS GNDAR4 RSVDAR40 QPI_DRX_DN[12] QPI IAR41 QPI_CLKRX_DP QPI IAR42 QPI_CLKRX_DN QPI I

Land Listing62 Datasheet AU3 RSVDAU30 VCC PWRAU31 VCC PWRAU32 VSS GNDAU33 VCC PWRAU34 VCC PWRAU35 VSS GNDAU36 VSS GNDAU37 QPI_DRX_DN[0] QPI IAU38 QPI_

Land ListingDatasheet 63AW22 VSS GNDAW23 VSS GNDAW24 VCC PWRAW25 VCC PWRAW26 VSS GNDAW27 VCC PWRAW28 VCC PWRAW29 VSS GNDAW3 RSVDAW30 VCC PWRAW31 VCC

Land Listing64 Datasheet B19 DDR0_MA[10] CMOS OB2 VSS GNDB20 RSVDB21 DDR0_MA[1] CMOS OB22 VDDQ PWRB23 DDR0_MA[4] CMOS OB24 DDR0_MA[5] CMOS OB25 DDR0_M

Land ListingDatasheet 65C24 DDR0_MA[6] CMOS OC25 VDDQ PWRC26 DDR0_MA[9] CMOS OC27 DDR1_CKE[3] CMOS OC28 DDR0_BA[2] CMOS OC29 DDR0_CKE[0] CMOS OC3 BPM

Land Listing66 Datasheet E17 DDR2_CS#[4] CMOS OE18 DDR0_CLK_N[2] CLOCK OE19 DDR0_CLK_N[3] CLOCK OE2 BPM#[7] GTL I/OE20 DDR0_CLK_P[3] CLOCK OE21 VDDQ P

Land ListingDatasheet 67G1 DDR0_DQ[44] CMOS I/OG10 DDR2_DQ[37] CMOS I/OG11 DDR2_DQ[36] CMOS I/OG12 VSS GNDG13 DDR1_WE# CMOS OG14 DDR1_RAS# CMOS OG15

Land Listing68 Datasheet H41 DDR0_DQ[16] CMOS I/OH42 RSVDH43 DDR0_DQ[17] CMOS I/OH5 VSS GNDH6 DDR1_DQS_P[5] CMOS I/OH7 RSVDH8 DDR1_DQ[40] CMOS I/OH9 D

Land ListingDatasheet 69K34 RSVDK35 DDR1_DQ[18] CMOS I/OK36 VSS GNDK37 RSVDK38 DDR2_DQ[23] CMOS I/OK39 DDR2_DQS_N[2] CMOS I/OK4 DDR1_DQ[48] CMOS I/OK

Datasheet 7Intel® Core™ i7 Processor Extreme Edition and Intel® Core™ i7 Processor Features• Available at 3.20 GHz, 2.93 GHz, and 2.66 GHz• Enhanced I

Land Listing70 Datasheet M27 VDDQ PWRM28 VSS GNDM29 VCC PWRM3 DDR0_DQ[52] CMOS I/OM30 VSS GNDM31 VCC PWRM32 VSS GNDM33 VCC PWRM34 DDR1_DQ[17] CMOS I/O

Land ListingDatasheet 71R38 DDR1_DQS_P[1] CMOS I/OR39 DDR2_DQ[10] CMOS I/OR4 DDR0_DQ[54] CMOS I/OR40 DDR2_DQ[15] CMOS I/OR41 VSS GNDR42 DDR0_DQ[3] CM

Land Listing72 Datasheet §W1 DDR0_DQS_N[7] CMOS I/OW10 DDR1_DQ[59] CMOS I/OW11 VCC PWRW2 DDR0_DQS_P[7] CMOS I/OW3 VSS GNDW33 VCCPLL PWRW34 DDR2_DQ[0]

Datasheet 73Signal Definitions5 Signal Definitions5.1 Signal DefinitionsTable 5-1. Signal Definitions (Sheet 1 of 4)Name Type Description NotesBCLK_D

Signal Definitions74 Datasheet DDR{0/1/2}_MA[15:0] O Selects the Row address for Reads and writes, and the column address for activates. Also used to

Datasheet 75Signal DefinitionsTHERMTRIP# O Assertion of THERMTRIP# (Thermal Trip) indicates the processor junction temperature has reached a level be

Signal Definitions76 Datasheet §VTT_VID[4:2] O VTT_VID[2:4] (VTTVoltage ID) are used to support automatic selection of power supply voltages (VTT). VT

Datasheet 77Thermal Specifications6 Thermal Specifications6.1 Package Thermal SpecificationsThe processor requires a thermal solution to maintain tem

Thermal Specifications78 Datasheet Section 6.3. The temperature reported over PECI is always a negative value and represents a delta below the onset o

Datasheet 79Thermal SpecificationsNotes:1. Refer to Table 6-2 for discrete points that constitute the thermal profile. 2. Refer to the appropriate pr

8 Datasheet Revision History§Revision NumberDescription Date-001 • Initial release November 2008

Thermal Specifications80 Datasheet 6.1.1.1 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROLWhen the DTS value is less than TC

Datasheet 81Thermal Specifications6.1.2 Thermal MetrologyThe minimum and maximum TTV case temperatures (TCASE) are specified in Table 6-1, and Table

Thermal Specifications82 Datasheet 6.2 Processor Thermal Features6.2.1 Processor TemperatureA new feature in the Intel Core™ i7 processor Extreme Edit

Datasheet 83Thermal Specifications6.2.2.1 Frequency/VID ControlWhen the Digital Temperature Sensor (DTS) reaches a value of 0 (DTS temperatures repor

Thermal Specifications84 Datasheet 6.2.2.2 Clock ModulationClock modulation is a second method of thermal control available to the processor. Clock mo

Datasheet 85Thermal Specificationsexternal source (e.g., a voltage regulator) to activate the TCC. The ability to activate the TCC via PROCHOT# can p

Thermal Specifications86 Datasheet 6.3.1.1 Fan Speed Control with Digital Thermal SensorFan speed control solutions use a value stored in the static v

Datasheet 87Thermal Specifications6.3.2 PECI Specifications6.3.2.1 PECI Device AddressThe PECI register resides at address 30h.6.3.2.2 PECI Command S

Thermal Specifications88 Datasheet 6.4 Storage Conditions SpecificationsEnvironmental storage condition limits define the temperature and relative hum

Datasheet 89Features7 Features7.1 Power-On Configuration (POC)Several configuration options can be configured by hardware. For electrical specificati

Datasheet 9Introduction1 IntroductionThe Intel® Core™ i7 processor Extreme Edition and Intel® Core™ i7 processor are intended for high performance hi

Features90 Datasheet 7.2.1 Thread and Core Power State DescriptionsIndividual threads may request low power states. Core power states are automaticall

Datasheet 91FeaturesWhile in C1/C1E state, the processor will process bus snoops and snoops from the other threads. 7.2.1.3 C3 StateIndividual thread

Features92 Datasheet If Intel QPI L1 has been granted, the processor will disable some clocks and PLLs and for processors with an integrated memory co

Datasheet 93Features7.5 Enhanced Intel SpeedStep® TechnologyThe processor features Enhanced Intel SpeedStep Technology. Following are the key feature

Features94 Datasheet

Datasheet 95Boxed Processor Specifications8 Boxed Processor Specifications8.1 IntroductionThe processor will also be offered as an Intel boxed proces

Boxed Processor Specifications96 Datasheet 8.2 Mechanical Specifications8.2.1 Boxed Processor Cooling Solution DimensionsThis section documents the me

Datasheet 97Boxed Processor SpecificationsNOTES:1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanic

Boxed Processor Specifications98 Datasheet 8.2.2 Boxed Processor Fan Heatsink WeightThe boxed processor fan heatsink will not weigh more than 550 gram

Datasheet 99Boxed Processor Specifications8.4 Thermal SpecificationsThis section describes the cooling requirements of the fan heatsink solution used