Intel CL8064701528402 Scheda Tecnica Pagina 115

  • Scaricare
  • Aggiungi ai miei manuali
  • Stampa
  • Pagina
    / 116
  • Indice
  • SEGNALIBRI
  • Valutato. / 5. Basato su recensioni clienti
Vedere la pagina 114
Datasheet 115
Package Mechanical Specifications
9 Package Mechanical
Specifications
The processor is in a Flip-Chip Land Grid Array (FCLGA12) package that interfaces with
the baseboard using an LGA2011-0 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor
component thermal solutions, such as a heatsink. Refer to the Processor Thermal
Mechanical Specifications and Design Guidelines (see Related Documents section) for
complete details on the LGA2011-0 socket.
§ §
Vedere la pagina 114
1 2 ... 110 111 112 113 114 115 116

Commenti su questo manuale

Nessun commento