Processor PCG

Package

TDP

Platform

TDP

Heatsink

Airflow,

RPM,

Maximum

CASE

Thermal

Profile

CASE-MAX

Platform

TDP

2C/GT2 35 W

2013A

35 W 35 W

Active Short

(DHA-D)

45.4 °C,

3000 RPM,

0.597 °C/W

y = 0.51 *

Power + 48.5

66.3 °C

4C/GT0 25 W

25 W 25 W

ATCA

Reference

Heatsink

67 °C,

10 CFM,

0.565 °C/W

y = 0.48 *

Power + 69.1

81.1 °C

2C/GT0 16 W

16 W 16 W

ATCA

Reference

Heatsink

67 °C,

10 CFM,

0.565 °C/W

y = 0.48 *

Power + 68.2

75.8 °C

Notes: 1. TDP shown here, 95 W for example, represents the maximum expected platform TDP in the next generation

platform for this type of SKU. This placeholder value is provided as a guideline for hardware design for the next

generation platform.

2. Platform Compatibility Guide (PCG) provides a design target for meeting all planned processor frequency

requirements. For more information, refer to Voltage and Current Specifications on page 94.

3. Package Thermal Design Power (TDP) is for the Intel

Xeon

processor E3-1200 v3 Product Family.

4. Platform Thermal Design Power (TDP) includes projections for the refresh processor that follow the Intel

Xeon

processor E3-1200 v3 Product Family in this platform.

5. Thermal Solution information can be found in the following table.

6. These boundary conditions and performance targets are used to generate processor thermal specifications and to

provide guidance for heatsink design. Values are for the heatsink shown in the adjacent column are calculated at sea

level, and are expected to meet the Thermal Profile at TDP. T

is the local ambient temperature of the heatsink

inlet air. Airflow is through the heatsink fins with zero bypass for a passive heatsink. RPM is fan revolutions per

minute for an active heatsink. Ѱ

is the maximum target (mean + 3 sigma) for the thermal characterization

parameter. For more information on the thermal characterization parameter, refer to the processor Thermal

Mechanical Design Guidelines (see Related Documents section).

7. Maximum T

CASE

Thermal Profile is the specification that must be complied to. Any Attempt to operate the processor

outside these operating limits may result in permanent damage to the processor and potentially other system

components.

8. T

CASE-MAX

at Platform TDP is calculated using the maximum T

CASE

Thermal Profile and the platform TDP.

9. ATCA Reference Heatsink supports Socket B and is not tooled for Socket H.

5.5 Processor Temperature

A software readable field in the TEMPERATURE_TARGET register that contains the

minimum temperature at which the TCC will be activated and PROCHOT# will be

asserted. The TCC activation temperature is calibrated on a part-by-part basis and

normal factory variation may result in the actual TCC activation temperature being

higher than the value listed in the register. TCC activation temperatures may change

based on processor stepping, frequency or manufacturing efficiencies.

5.6

Adaptive Thermal Monitor

The Adaptive Thermal Monitor feature provides an enhanced method for controlling

the processor temperature when the processor silicon exceeds the Thermal Control

Circuit (TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to

reduce processor power using a combination of methods. The first method (Frequency

control, similar to Thermal Monitor 2 (TM2) in previous generation processors)

involves the processor reducing its operating frequency (using the core ratio

multiplier) and internal core voltage. This combination of lower frequency and core

voltage results in a reduction of the processor power consumption. The second

method (clock modulation, known as Thermal Monitor 1 or TM1 in previous generation

processors) reduces power consumption by modulating (starting and stopping) the

internal processor core clocks. The processor intelligently selects the appropriate TCC

Thermal Management—Processor

Intel

Xeon

Processor E3-1200 v3 Product Family

June 2013 Datasheet – Volume 1 of 2

Order No.: 328907-001 69

1 2 ... 64 65 66 67 68 69 70 71 72 73 74 ... 115 116

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Table des matières

DMSSHIli:

SAFETY RULES

PRODUCT SPECIFICATIONS

MAINTENANCE AGREEMENT

CONTENTS

ACCESSORIES AND ATTACHMENTS

CONTENTS OF HARDWARE PACK

ASSiMBLY

ASSEMBLY

OPERATION

OPEBATION

CUSTOMER RESPONSIBILITIES

CUSTOMER RESPOMSIBiLITIES

CUSTOMER RESPOMSiBILITIES

SERVICE AND ADJUSTMENTS

ADJUSTMENTS

FUEL SYSTEM

ENGINE OIL

CYLINDERS

TROUBLESHOOTING POINTS

SCHEMATIC

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