Intel HH80552PG0882M Scheda Tecnica Scaricare il pdf (Pagina 38)

38 Datasheet

Package Mechanical Specifications

3.1.5 Package Insertion Specifications

The Pentium 4 processor in the 775-land package can be inserted into and removed from a

LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the

LGA775 Socket Mechanical Design Guide.

3.1.6 Processor Mass Specification

The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass

[weight] includes all the components that are included in the package.

3.1.7 Processor Materials

Table 3-3 lists some of the package components and associated materials.

3.1.8 Processor Markings

Figure 3-5 shows the topside markings on the processor. These diagrams are to aid in the

identification of the Pentium 4 processor in the 775-land package.

Table 3-3. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Lands Gold Plated Copper

Figure 3-5. Processor Top-Side Markings

ATPO

S/N

INTEL m © ‘04

Pentium® 4

3.60GHZ/1M/800/04B

SLxxx [COO]

[FPO]

1 2 ... 33 34 35 36 37 38 39 40 41 42 43 ... 93 94

Nessun commento

Intel HH80552PG0882M Scheda Tecnica Pagina 38