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6 Datasheet
21 Package Handling Guidelines......................................................................................39
22 Processor Materials...................................................................................................40
23 Alphabetical Land Assignments...................................................................................46
24 Numerical Land Assignment.......................................................................................56
25 Signal Description ( ) ................................................................................................66
26 Processor Thermal Specifications................................................................................76
27 Thermal Profile.........................................................................................................77
28 Thermal “Diode” Parameters using Diode Model............................................................82
29 Thermal “Diode” Parameters using Transistor Model......................................................83
30 Thermal Diode Interface............................................................................................83
31 GetTemp0() Error Codes ...........................................................................................86
32 Power-On Configuration Option Signals .......................................................................87
33 Fan Heatsink Power and Signal Specifications...............................................................97
- Celeron 1
- Processor 400 1
- 2 Datasheet 2
- Contents 3
- 4 Datasheet 4
- Datasheet 5 5
- 6 Datasheet 6
- Revision History 7
- Series Features 8
- 1 Introduction 9
- Introduction 10
- 10 Datasheet 10
- 1.2 References 11
- 12 Datasheet 12
- 2 Electrical Specifications 13
- 2.3 Voltage Identification 14
- Datasheet 15 15
- Electrical Specifications 15
- 1, 2, 3, 4 16
- Datasheet 17 17
- 18 Datasheet 18
- Datasheet 19 19
- Table 6. V 20
- Overshoot 21
- 2.7 Signaling Specifications 22
- 2.7.1 FSB Signal Groups 23
- 24 Datasheet 24
- Datasheet 25 25
- 26 Datasheet 26
- Datasheet 27 27
- 2.8 Clock Specifications 28
- Datasheet 29 29
- 30 Datasheet 30
- VHavg (mV) 31
- 250 + 0.5 (VHavg - 700) 31
- 550 + 0.5 (VHavg - 700) 31
- 32 Datasheet 32
- 2.9 PECI DC Specifications 34
- 3 Package Mechanical 35
- Specifications 35
- 36 Datasheet 36
- Datasheet 37 37
- 38 Datasheet 38
- Datasheet 39 39
- 3.7 Processor Materials 40
- 3.8 Processor Markings 40
- Preliminary 41
- Socket 775 41
- Quadrants 41
- Top View 41
- 42 Datasheet 42
- 4 Land Listing and Signal 43
- Descriptions 43
- 44 Datasheet 44
- Datasheet 45 45
- Table 23. Alphabetical Land 46
- Assignments 46
- Table 24. Numerical Land 56
- Assignment 56
- 66 Datasheet 66
- Datasheet 67 67
- 68 Datasheet 68
- Datasheet 69 69
- 70 Datasheet 70
- Datasheet 71 71
- 72 Datasheet 72
- Datasheet 73 73
- 74 Datasheet 74
- 5 Thermal Specifications and 75
- Design Considerations 75
- Table 27. Thermal Profile 77
- Figure 16. Thermal Profile 77
- 78 Datasheet 78
- 5.2.2 Thermal Monitor 2 79
- 80 Datasheet 80
- 5.2.4 PROCHOT# Signal 81
- 5.2.5 THERMTRIP# Signal 81
- 5.3 Thermal Diode 82
- Datasheet 83 83
- PECI Host 84
- Controller 84
- Domain 0 84
- Datasheet 85 85
- 5.4.2 PECI Specifications 86
- 6 Features 87
- 6.2.1 Normal State 88
- 6.2.3 Stop Grant State 89
- Features 90
- 90 Datasheet 90
- Datasheet 91 91
- 7.1 Mechanical Specifications 92
- Boxed Proc OverallView 93
- 7.2 Electrical Requirements 94
- 7.3 Thermal Specifications 95
- 96 Datasheet 96
- 7.3.2 Variable Speed Fan 97
- 98 Datasheet 98
- 8 Debug Tools Specifications 99
- Debug Tools Specifications 100
- 100 Datasheet 100
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