Thermal Specifications and Design Considerations

90 Mobile Intel



Pentium



4 Processor-M Datasheet

and is not representative of the absolute maximum power the processor may dissipate under worst case

conditions.

2. Not 100% tested. These power specifications are determined by characterization of the processor currents at

higher temperatures and extrapolating the values for the temperature indicated.

3. The maximum junction temperature (T

) is specified as the hottest location on the die. The thermal monitor’s

automatic mode is used to indicate that the maximum T

has been reached. Refer to Section 6.1.1 for T

measurement guidelines (Refer to Section 6.1.2 for thermal monitor details).

6.1 Thermal Specifications

6.1.1 Thermal Diode

The Mobile Intel Pentium 4 Processor-M incorporates two methods of monitoring die temperature,

the thermal monitor and the thermal diode. The thermal monitor (detailed in

Section 6.1.2) must be

used to determine when the minimum or maximum specified processor junction temperature has

been reached.

The second method, the thermal diode, can be read by an off-die analog/digital

converter (a thermal sensor) located on the motherboard, or a stand-alone measurement kit. The

thermal diode may be used to monitor the die temperature of the processor for thermal

management or instrumentation purposes but cannot be used to indicate that the maximum T

the processor has been reached.

Table 39 and Table 40 provide the diode interface and

specifications.

Note: The reading of the thermal sensor connected to the thermal diode does not reflect the temperature

of the hottest location on the die (T

). This is due to inaccuracies in the thermal diode, on-die

temperature gradients between the location of the thermal diode and the hottest location on the die,

and time based variations in the die temperature. Time based variations can occur since the

sampling rate of the sensor is much slower than the die level temperature changes.

The offset between the thermal diode based temperature reading and the hottest location of the die

(thermal monitor) may be characterized using the thermal monitor’s Automatic mode activation of

thermal control circuit. This temperature offset must be taken into account when using the

processor thermal diode to implement power management events.

Table 39. Thermal Diode Interface

Table 40. Thermal Diode Specifications

NOTES:

1. Intel does not support or recommend operation of the thermal diode under reverse bias.

2. Characterized at 100°C.

3. Not 100% tested. Specified by design characterization.

4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode

equation:

*(e

(qVD/nkT)

-1)

Signal Name Pin/Ball Number Signal Description

THERMDA B3 Thermal diode anode

THERMDC C4 Thermal diode cathode

Symbol Parameter Min Typ Max Unit Notes

Forward Bias Current 5 300 µA 1

n Diode Ideality Factor 1.0012 1.0021 1.0030 2, 3, 4

Series Resistance 3.86 ohms 2, 3, 5

1 2 ... 85 86 87 88 89 90 91 92 93 94 95 96 97

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