Intel BX80570E8200A Scheda Tecnica Pagina 101
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Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 101
Figure 7-31. Thermocouple placed into groove
29. Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (Figure
7-32).
Figure
7-32. Removing Excess Solder
Note: Take usual precautions when using open blades
30. Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (Figure
7-33).
- Contents 3
- Figures 6
- Revision History 9
- 1 Introduction 11
- 1.1.3 Document Scope 12
- 1.2 References 13
- 1.3 Definition of Terms 13
- measurements 14
- Information 15
- 2.1.2 Heatsink Attach 17
- 2.2 Thermal Requirements 18
- 2.2.2 Thermal Profile 19
- 2.2.4 T 20
- 7, Intel 21
- 2.3.4 and 21
- 2.3.1 Heatsink Size 22
- 2.3.2 Heatsink Mass 22
- 2.3.3 Package IHS Flatness 23
- 2.4.3 Summary 25
- 3 Thermal Metrology 27
- 3.1.1 Example 28
- Assessment 29
- Guidelines 29
- 3-3. The 30
- Thermal Metrology 31
- Thermal Monitor Feature 33
- 4.2.1 PROCHOT# Signal 34
- 4.2.3 Thermal Monitor 2 35
- 4.2.5 On-Demand Mode 37
- 4.2.6 System Considerations 37
- Considerations 38
- 4.2.8 THERMTRIP# Signal 38
- 7 and the Intel 40
- (BTX) Thermal/Mechanical 41
- Design Information 41
- 5.1.2 Acoustics 42
- 5.1.3 Effective Fan Curve 43
- Airflow (cfm) 44
- 5.1.5 Altitude 45
- 5-2. Random Vibration PSD 46
- 5.2.2 Power Cycling 47
- 5.4 Safety Requirements 49
- Thermal Module Assembly 49
- Detail A 52
- Detail B 52
- 6 ATX Thermal/Mechanical 53
- Appendix H 54
- 6.2.1 Heatsink Performance 55
- 6.2.2 Acoustics 56
- 6.2.3 Altitude 56
- 3.3 and 6.6) 57
- 6-3. Random Vibration PSD 58
- 6.3.2 Power Cycling 59
- 6.5 Safety Requirements 61
- Thermal Mechanical Design 61
- Less curvature in 62
- Shock Load 62
- Core shoulder 63
- 7 Intel 65
- Quiet System 65
- Technology (Intel 65
- 7-1. Intel 66
- RPM Temperature 67
- 7-3 and listed below: 68
- 7-3. Intel 68
- 7.3 Intel 70
- A.3.1, and A.3.2 76
- Metrology 77
- B.1 Overview 77
- B.2 Test Preparation 77
- Heatsink Clip Load Metrology 78
- Load Cells (3x) 79
- Preload Fixture (copper 79
- B.3 Test Procedure Examples 80
- Measurement 81
- Appendix C Thermal Interface 83
- Management 83
- C.1 Bond Line Management 83
- C.2 Interface Material Area 83
- Thermal Interface Management 84
- Appendix D Case Temperature 85
- Reference Metrology 85
- D.1 Objective and Scope 85
- 7-11. Order 86
- 7-11. Omega Thermocouple 86
- D.4 IHS Groove 87
- 7-14 for the 775-Land 90
- D.2 and D.3 91
- 7-16) 91
- 7-17) 91
- 7-19-A and B) 92
- TC Wire with Insulation 94
- IHS with Groove 94
- 7-24) 95
- 7-25) 96
- 7-25. Cutting Solder 96
- 7-26) 96
- D.5.3 Solder Process 97
- 7-27. Solder Station Setup 98
- 7-28 and Figure 7-29) 98
- Installation 100
- 7-32) 101
- 7-33) 101
- 7-34) 102
- 7-36) 103
- Extended (BTX) System 105
- Thermal Considerations 105
- Thermal 107
- MCH Heatsink 107
- Reference Design 109
- BOARD PRIMARY SIDE 112
- BOARD SECONDARY SIDE 113
- Mechanical Drawings 114
- Figure 7-54. Intel 126
- Appendix H Intel 127
- Enabled Reference 127
- Solution Information 127
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