Intel B80532PG0962M Scheda Tecnica Scaricare il pdf (Pagina 39)

Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet 39

Package Mechanical Specifications

Figure 3-3 details the keep-in specification for pin-side components. The Pentium 4 processor on

0.13 micron process may contain pin-side capacitors mounted to the processor package.

Figure 3-5 details the flatness and tilt specifications for the IHS. Tilt is measured with the reference

datum set to the bottom of the processor susbstrate.

NOTES:

1. Pin plating consists of 0.2 micrometers Au over 2.0 micrometer Ni.

2. 0.254 mm diametric true position, pin-to-pin.

Figure 3-3. Processor Cross-Section and Keep-In

Figure 3-4. Processor Pin Detail

13.97mm

1.25mm

IHS

FCPGA

Component Keepin

Socket must allow clearance

for pin shoulders and mate

flush with this surface

Substrate

13.97mm

1.25mm

IHS

FCPGA

Component Keepin

Socket must allow clearance

for pin shoulders and mate

flush with this surface

Substrate

PINHEAD DIAMETER

Ø 0.65 MAX

KEEP OUT ZONE

Ø 1.032 MAX

2.03±0.08

SOLDER FILLET HEIGHT

0.3 MAX

ALL DIMENSIONS ARE IN MILIMETERS

Ø 0.305±0.025

1 2 ... 34 35 36 37 38 39 40 41 42 43 44 ... 84 85

Nessun commento

Intel B80532PG0962M Scheda Tecnica Pagina 39