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4 Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
6.3 Thermal Monitor .................................................................................................. 74
6.3.1 Thermal Diode........................................................................................ 76
7 Boxed Processor Specifications ....................................................................... 77
7.1 Introduction ......................................................................................................... 77
7.2 Mechanical Specifications................................................................................... 78
7.2.1 Boxed Processor Cooling Solution Dimensions..................................... 78
7.2.2 Boxed Processor Fan Heatsink Weight.................................................. 79
7.2.3 Boxed Processor Retention Mechanism and Heatsink Assembly.......... 79
7.3 Electrical Requirements ...................................................................................... 80
7.3.1 Fan Heatsink Power Supply................................................................... 80
7.4 Thermal Specifications........................................................................................ 82
7.4.1 Boxed Processor Cooling Requirements ............................................... 82
7.4.2 Variable Speed Fan ............................................................................... 83
8 Debug Tools Specifications................................................................................. 85
8.1 Logic Analyzer Interface (LAI)............................................................................. 85
8.1.1 Mechanical Considerations .................................................................... 85
8.1.2 Electrical Considerations........................................................................ 85
- Datasheet 1
- Technology 1
- 2 Intel 2
- Contents 3
- Revision History 7
- Introduction 1 9
- 10 Intel 10
- 1.1 Terminology 11
- 1.2 References 12
- Introduction 13
- Electrical Specifications 2 15
- 2.3 Decoupling Guidelines 16
- 2.4 Voltage Identification 16
- 18 Intel 18
- 20 Intel 20
- 2.6 System Bus Signal Groups 21
- 2.7 Asynchronous GTL+ Signals 22
- 2.10 Maximum Ratings 23
- Electrical Specifications 24
- 28 Intel 28
- 30 Intel 30
- 36 Intel 36
- 35mm square 37
- 478 pins 37
- Code Letter 38
- Dimension (mm) 38
- Min Nominal Max 38
- 40 Intel 40
- 3.4 Processor Materials 41
- 3.5 Processor Markings 42
- 44 Intel 44
- 4.1 Processor Pin Assignments 45
- 46 Intel 46
- IMPSEL AE26 Power/Other Input 47
- 48 Intel 48
- 50 Intel 50
- 52 Intel 52
- 54 Intel 54
- 56 Intel 56
- 4.2 Signal Descriptions 58
- Name Type Description 59
- 60 Intel 60
- Signals Associated Strobe 61
- °C. Upon assertion of 65
- 66 Intel 66
- Considerations 5 67
- 68 Intel 68
- 5.1.1 Thermal Specifications 68
- 5.1.2 Thermal Metrology 70
- Features 6 71
- 72 Intel 72
- 6.3 Thermal Monitor 74
- 6.3.1 Thermal Diode 76
- 7.1 Introduction 77
- 7.2 Mechanical Specifications 78
- Assembly 79
- 7.3 Electrical Requirements 80
- with a resistor 81
- IC: Fan current draw 740 mA 81
- 7.4 Thermal Specifications 82
- 7.4.2 Variable Speed Fan 83
- 84 Intel 84
- Debug Tools Specifications 8 85
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