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Intel® Workstation Board S5520SC TPS Design and Environmental Specifications
Revision 1.7
Intel order number: E39530-010
127
9. Design and Environmental Specifications
9.1 Intel
®
Workstation Board S5520SC Design Specifications
Operation of the Intel
®
Workstation Board S5520SC at conditions beyond those listed in the
following table may cause permanent damage to the system. Exposure to absolute maximum
rating conditions for extended periods may affect system reliability.
Table 75. Workstation Board Design Specifications
Operating Temperature 0º C to 55º C 1 (32º F to 131º F)
Non-Operating Temperature -40º C to 70º C (-40º F to 158º F)
DC Voltage ± 5% of all nominal voltages
Shock (Unpackaged) Trapezoidal, 50 G, 170 inches/sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random
Note:
1
Chassis design must provide proper airflow to avoid exceeding the processor maximum case temperature.
Disclaimer Note: Intel Corporation server and workstation boards contain a number of high-
density VLSI and power delivery components that need adequate airflow to cool. Intel ensures
through its own chassis development and testing that when Intel
®
server/workstation building
blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses
not to use Intel
®
developed server/workstation building blocks to consult vendor datasheets and
operating parameters to determine the amount of airflow required for their specific application
and environmental conditions. Intel Corporation cannot be held responsible, if components fail
or the server or workstation board does not operate correctly when used outside any of its
published operating or non-operating limits.
9.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 30°C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,
electrical and/or thermal stress and for device maturity. You should MTBF estimates as
“reference numbers” only.
- Workstation Board S5520SC 1
- Revision History 2
- Disclaimers 3
- Table of Contents 4
- List of Figures 9
- Revision 1.7 10
- List of Tables 11
- 1. Introduction 15
- 2. Overview 16
- Overview 19
- 3. Functional Architecture 30
- 3.1 Intel 31
- 5520 I/O Hub (IOH) 31
- 3.2 Processor Support 32
- 3.2.3 Intel 34
- Technology (EIST) 34
- 3.3 Memory Subsystem 36
- 3.3.2 Supported Memory 38
- 3.3.5 Memory Interleaving 42
- 3.3.6 Memory Test 43
- 3.3.7 Memory Scrub Engine 43
- 3.3.8 Memory RAS 43
- Tables 5 and 6 47
- 3.4 ICH10R 49
- Revision 1.7 50
- 3.5 PCI Subsystem 52
- 3.6 Intel 53
- 3.6.1 SAS RAID Support 54
- 3.8 Serial Ports 57
- 3.9 Floppy Disk Controller 58
- 3.11 Video Support 58
- 3.11.1 Video Modes 59
- 3.11.2 Dual Video 59
- 3.13 Audio Codec 62
- 3.14 IEEE 1394a Support 63
- 3.15.1 Overview 64
- 3.15.2 TPM security BIOS 64
- 3.16 ACPI Support 67
- 3.17 Intel 67
- Virtualization Technology 67
- 4. Platform Management 68
- 4.2.3 Media Redirection 71
- 4.2.5 Embedded Web server 73
- 4.3 Platform Control 74
- 4.3.2 Fan Speed Control 75
- 4.4 Intel 78
- 5. BIOS Setup Utility 80
- 5.3.1 Operation 81
- 5.3.2.1 Main Screen 84
- 5.3.2.2.1 Processor Screen 87
- 5.3.2.2.2 Memory Screen 90
- 5.3.2.2.6 PCI Screen 98
- Revision 1.7 103
- 5.3.2.6 Boot Options Screen 108
- 6.2 Power Connectors 119
- 6.3.1 Intel 121
- RMM3) Connector 121
- 6.3.2 LCP/IPMB Header 121
- 6.4 Front Panel Connector 122
- 6.5 I/O Connectors 123
- 6.5.3 SAS Module Slot 124
- 6.5.5 USB Connector 125
- 6.5.6 IEEE 1394a connectors 127
- 6.6 Audio Connectors 128
- 6.7 Onboard Video Header 128
- 6.8 Fan Headers 129
- 7. Jumper Blocks 131
- 7.1.1 Clearing the CMOS 132
- 7.1.2 Clearing the Password 132
- 7.3 BIOS Recovery 133
- 8. Intel 135
- Light Guided Diagnostics 135
- 8.2 Fan Fault LEDs 136
- A. System Status LED 137
- B. System ID LED 137
- 8.4 DIMM Fault LEDs 139
- 9.1 Intel 141
- 9.2 MTBF 141
- Table 76. MTBF Estimate 142
- Revision 1.7 144
- 9.4.1 Grounding 145
- 9.4.2 Stand-by Outputs 146
- 9.4.3 Remote Sense 146
- 9.4.4 Voltage Regulation 146
- 9.4.5 Dynamic Loading 147
- 9.4.6 Capacitive Loading 147
- 9.4.7 Ripple/Noise 147
- 9.4.8 Timing Requirements 148
- Table 84. Turn On/Off Timing 149
- FCC (USA) 153
- ICES-003 (Canada) 155
- VCCI (Japan) 155
- BSMI (Taiwan) 155
- RRL KCC (Korea) 156
- 10.7 CA Perchlorate Warning 159
- Appendix B: Compatible Intel 162
- Server Chassis 162
- POST Error Beep Codes 185
- Glossary 188
- Reference Documents 192
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